Crystal taking method of die bonder

The invention relates to a crystal taking method of a die bonder, which comprises the following steps of: S1, placing a new wafer table; s2, the operation control system controls a visual system to carry out image recognition at the photographing position, and whether the current wafer taking coordi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HUANG BOCAI, LIU SHAOJUN, LI JIANYANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMAGE DATA PROCESSING OR GENERATION, IN GENERAL PHYSICS SEMICONDUCTOR DEVICES
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