Crystal taking method of die bonder

The invention relates to a crystal taking method of a die bonder, which comprises the following steps of: S1, placing a new wafer table; s2, the operation control system controls a visual system to carry out image recognition at the photographing position, and whether the current wafer taking coordinate is effective or not is judged; s3, a welding head is controlled to carry out a crystal taking action; s4, moving the welding head to a die bonding area for die bonding; s5, if the wafer taking of the current wafer table is not completed, executing the step S6, and if the wafer taking is completed, ending the wafer taking; s6, image acquisition is carried out, and mechanical coordinates of the wafer identified in the image are calculated; determining the positions of all the recognized wafers in the matrix M by comparing the mechanical coordinates of the current position with the mechanical coordinates of all the recognized wafers, and recording the mechanical coordinates of all the recognized wafers in the mat