Manufacturing method of low-carbon cluster gate oxide of SiC MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) device
The invention belongs to the technical field of semiconductors, and discloses a method for manufacturing low-carbon cluster gate oxide of a silicon carbide metal oxide semiconductor field effect transistor (SiC MOSFET) device, which comprises the following steps of: depositing a SiC epitaxial layer...
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creator | YU HENGWEN LEE MIN-JU MA LIQI ZHENG YINGHAO |
description | The invention belongs to the technical field of semiconductors, and discloses a method for manufacturing low-carbon cluster gate oxide of a silicon carbide metal oxide semiconductor field effect transistor (SiC MOSFET) device, which comprises the following steps of: depositing a SiC epitaxial layer on a SiC substrate; carrying out ion implantation on the SiC epitaxial layer and carrying out high-temperature annealing; growing a Si epitaxial layer on the SiC epitaxial layer; growing a gate oxide SiO2 layer on the Si epitaxial layer by using a low-temperature thermal oxidation method; gate oxide polycrystalline silicon deposition is carried out on the gate oxide SiO2 layer; performing gate oxide pattern photoetching on the deposited gate oxide polycrystalline silicon; gate oxide polycrystalline silicon etching and gate oxide etching are carried out; according to the invention, the formation of the inferior structure of the carbon cluster on the interface of the gate oxide SiO2 and the SiC epitaxial layer in the |
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carrying out ion implantation on the SiC epitaxial layer and carrying out high-temperature annealing; growing a Si epitaxial layer on the SiC epitaxial layer; growing a gate oxide SiO2 layer on the Si epitaxial layer by using a low-temperature thermal oxidation method; gate oxide polycrystalline silicon deposition is carried out on the gate oxide SiO2 layer; performing gate oxide pattern photoetching on the deposited gate oxide polycrystalline silicon; gate oxide polycrystalline silicon etching and gate oxide etching are carried out; according to the invention, the formation of the inferior structure of the carbon cluster on the interface of the gate oxide SiO2 and the SiC epitaxial layer in the</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230912&DB=EPODOC&CC=CN&NR=116741628A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230912&DB=EPODOC&CC=CN&NR=116741628A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YU HENGWEN</creatorcontrib><creatorcontrib>LEE MIN-JU</creatorcontrib><creatorcontrib>MA LIQI</creatorcontrib><creatorcontrib>ZHENG YINGHAO</creatorcontrib><title>Manufacturing method of low-carbon cluster gate oxide of SiC MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) device</title><description>The invention belongs to the technical field of semiconductors, and discloses a method for manufacturing low-carbon cluster gate oxide of a silicon carbide metal oxide semiconductor field effect transistor (SiC MOSFET) device, which comprises the following steps of: depositing a SiC epitaxial layer on a SiC substrate; carrying out ion implantation on the SiC epitaxial layer and carrying out high-temperature annealing; growing a Si epitaxial layer on the SiC epitaxial layer; growing a gate oxide SiO2 layer on the Si epitaxial layer by using a low-temperature thermal oxidation method; gate oxide polycrystalline silicon deposition is carried out on the gate oxide SiO2 layer; performing gate oxide pattern photoetching on the deposited gate oxide polycrystalline silicon; gate oxide polycrystalline silicon etching and gate oxide etching are carried out; according to the invention, the formation of the inferior structure of the carbon cluster on the interface of the gate oxide SiO2 and the SiC epitaxial layer in the</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjL0OgjAURlkcjPoO102HDqhBV0MgLsgAu6ntLTYpvaQ_6uSzC4kP4PQl55x88-RTcRsVFyE6bTvoMTxIAikw9GKCuztZECb6gA46HhDorSVOQaNzqOqmLFrYVBi4YfWkWIO9FmRlFIEclBqNhEIpFAFax63XfuRbkPjUApfJTHHjcfXbRbIeD_MLw4Fu6Acu0GK45dc0zY6HNNudzvt_mi-8Dkb5</recordid><startdate>20230912</startdate><enddate>20230912</enddate><creator>YU HENGWEN</creator><creator>LEE MIN-JU</creator><creator>MA LIQI</creator><creator>ZHENG YINGHAO</creator><scope>EVB</scope></search><sort><creationdate>20230912</creationdate><title>Manufacturing method of low-carbon cluster gate oxide of SiC MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) device</title><author>YU HENGWEN ; 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carrying out ion implantation on the SiC epitaxial layer and carrying out high-temperature annealing; growing a Si epitaxial layer on the SiC epitaxial layer; growing a gate oxide SiO2 layer on the Si epitaxial layer by using a low-temperature thermal oxidation method; gate oxide polycrystalline silicon deposition is carried out on the gate oxide SiO2 layer; performing gate oxide pattern photoetching on the deposited gate oxide polycrystalline silicon; gate oxide polycrystalline silicon etching and gate oxide etching are carried out; according to the invention, the formation of the inferior structure of the carbon cluster on the interface of the gate oxide SiO2 and the SiC epitaxial layer in the</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Manufacturing method of low-carbon cluster gate oxide of SiC MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) device |
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