Preparation process of copper strip for high-luminous-efficiency LED (light-emitting diode) bracket

The invention relates to the technical field of copper and copper alloy processing, in particular to a preparation process of a copper strip for a high-luminous-efficiency LED (light-emitting diode) support, which comprises the following nine procedures: (1) smelting: (2) hot rolling; (3) surface mi...

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Bibliographische Detailangaben
Hauptverfasser:	LU CHUANDONG, ZHANG GANG, TIAN WEI, SUN MIAO, GE QINGYUN, WEN ZHILING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES ALLOYS BASIC ELECTRIC ELEMENTS CABLES CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONDUCTORS DIFFUSION TREATMENT OF METALLIC MATERIAL DYES ELECTRICITY FERROUS OR NON-FERROUS ALLOYS GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUSMETALS OR ALLOYS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INSULATORS MAKING METAL MALLEABLE BY DECARBURISATION, TEMPERING OR OTHERTREATMENTS MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL METALLURGY METALLURGY OF IRON MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NATURAL RESINS NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PAINTS PERFORMING OPERATIONS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH PUNCHING METAL ROLLING OF METAL SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SKI WAXES TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	The invention relates to the technical field of copper and copper alloy processing, in particular to a preparation process of a copper strip for a high-luminous-efficiency LED (light-emitting diode) support, which comprises the following nine procedures: (1) smelting: (2) hot rolling; (3) surface milling; (4) rough rolling; (5) primary finish rolling; (6) low-temperature annealing; (7) secondary finish rolling; (8) polishing; and (9) slitting and delivery are carried out, the Vickers hardness HV of the prepared copper strip for the LED support reaches up to 136, the electric conductivity reaches up to 25.3% IACS, the heat conductivity reaches up to 128 W/m.K, the surface roughness Ra is smaller than 0.09 micron, and an LED lighting product prepared by using the copper strip for the LED support has the characteristic of high light efficiency. 本发明涉及铜及铜合金加工技术领域，具体涉及一种高光效LED支架用铜带的制备工艺，包括九道工序，分别为(1)熔炼：(2)热轧；(3)铣面；(4)粗轧；(5)首轮精轧；(6)低温退火；(7)次轮精轧；(8)抛光；(9)分切交付，制备出的LED支架用铜带的维氏硬度HV高达136，导电率高达25.3％IACS，导热率高达128W/m·K，表面粗糙