Polyimide resin

The invention provides a polyimide resin, which is formed by polymerization of terminal amino modified polyphenylene ether resin and tetracarboxylic dianhydride. The dielectric loss of the polyimide resin under the electromagnetic wave frequency of 10GHz is 0.0040 or below, and the water absorption...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HUANG WEIRU, LIU JIALIN, WEI QIANKAI, LIAO DECHAO, ZHANG HONGYI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The invention provides a polyimide resin, which is formed by polymerization of terminal amino modified polyphenylene ether resin and tetracarboxylic dianhydride. The dielectric loss of the polyimide resin under the electromagnetic wave frequency of 10GHz is 0.0040 or below, and the water absorption rate is 1t; the glass transition temperature is greater than 250 DEG C. 本发明提供一种聚酰亚胺树脂，借由使用末端胺基改质聚苯醚树脂与四羧酸二酐聚合而成。此聚酰亚胺树脂在10GHz电磁波频率下的介电损耗为0.0040以下，吸水率