SUBSTRATE PROCESSING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND PROGRAM

A substrate processing apparatus is provided with: a load lock chamber into and out of which a substrate is carried; a support member which is provided in the load lock chamber and supports the plurality of substrates in a plurality of layers at predetermined intervals; and a temperature sensor capable of measuring, in a non-contact manner, the temperature of the support in a state in which the substrate is supported. 一种基板处理装置，具备：装载锁定室，其被搬入和搬出基板；支承件，其设置于装载锁定室内，以预定的间隔多层地支承多个基板；以及温度传感器，其能够以非接触的方式测定支承基板的状态下的支承件的温度。