Microwave module electromagnetic band gap packaging structure based on embedded pin unit

The invention provides a microwave module electromagnetic band gap packaging structure based on an embedded pin unit, which comprises a microstrip line substrate, 50-ohm microstrip lines, a metal wall and a metal cover plate, and is characterized in that two bent 50-ohm microstrip lines are distributed on the microstrip line substrate, and the two 50-ohm microstrip lines are isolated through the metal wall; pins which are periodically arranged are arranged below the metal cover plate, grooves which are periodically arranged are etched in the top surface of the metal wall, and the pins correspond to the grooves in position; the metal cover plate is loaded on the microstrip line substrate, and the pins are embedded into the corresponding grooves to form embedded pin units; and the two 50-ohm microstrip lines form four input and output ports of the electromagnetic band gap packaging structure of the microwave module at the inlet and outlet positions of the microstrip line substrate. While the characteristic and