Multi-peak light emitting diode structure and packaging device thereof

The invention relates to a multimodal light emitting diode structure and a packaging device thereof. The device comprises a substrate; the first chip unit comprises a first epitaxial structure and a second epitaxial structure which are alternately arranged along the horizontal direction of the surface of the substrate; the second chip unit is arranged on the first chip unit in a bonding mode, and the second chip unit comprises a third epitaxial structure; wherein the first epitaxial structure, the second epitaxial structure and the third epitaxial structure are respectively one of blue light epitaxy, dark green light epitaxy and red light epitaxy and are different from one another. According to the invention, modulation of spectrums in different periods of sunlight-like illumination can be improved, and modulation of light intensity of the display screen under different currents is realized. 本发明涉及一种多峰发光二极管结构及其封装器件。本发明包括衬底；第一芯片单元，包括沿所述衬底表面水平方向交替设置的第一外延结构和第二外延结构；第二芯片单元，通过键合的方式设置于所述第一芯片单元上，所述第二芯片单元包括第三外延结构；其中，所述