Three-dimensional high-density integrated high-power microwave assembly

The invention discloses a three-dimensional high-density integrated high-power microwave assembly, which comprises a ceramic tube shell, a high-power power amplifier slide, a special-shaped metal heat dissipation platform, a middle-layer ceramic substrate, a microwave chip, an upper-layer ceramic substrate, a power supply chip, a passive device and a metal cap, the bottom-layer ceramic tube shell, the middle-layer ceramic substrate and the upper-layer ceramic substrate are vertically interconnected through BGA solder balls; the bottom high-power power amplifier slide glass is directly sintered with the metal heat sink of the bottom-layer ceramic tube shell; the large heat dissipation component of the stacking layer is connected with the bottom metal heat sink through the special-shaped metal heat sink platform; the chip and the passive device are connected with a wiring bonding pad on the ceramic substrate through a lead structure; the upper ceramic substrate, the lower ceramic substrate, the metalized throug