Silicon-based power discrete device electronic chip and packaging method

The invention discloses a silicon-based power discrete device electronic chip, which comprises an electronic chip main body, a protection mechanism is glued on the surface of the electronic chip main body, the protection mechanism comprises an adhesive, and a fixing frame is glued on one side, far a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ZHANG TANGXIN, REN HONGZHI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a silicon-based power discrete device electronic chip, which comprises an electronic chip main body, a protection mechanism is glued on the surface of the electronic chip main body, the protection mechanism comprises an adhesive, and a fixing frame is glued on one side, far away from the electronic chip main body, of the adhesive. According to the invention, the fixing frame can be adhered to the top end of the electronic chip main body through the adhesive, and at the moment, the adjusting screw sleeve moves on the surface of the fixing stud, so that the adjusting screw sleeve can conveniently drive the protection frame to be clamped on the surface of the electronic chip main body; the sealing performance between the protection frame and the electronic chip main body can be improved through the first sealing strip and the second sealing strip, so that the pin welding spots of the electronic chip main body can be conveniently protected, and the situation that the use of the electronic