High pressure cleaning method and apparatus for cleaning semiconductor chamber components

Embodiments of methods and cleaning systems for cleaning components used in a substrate processing apparatus are provided herein. In certain embodiments, a cleaning system includes a boiler having a heater configured to heat a fluid; a cleaning chamber fluidly coupled to the boiler via at least one of a gas line and a liquid line, where the cleaning chamber includes one or more clamps in its interior space for holding at least one component to be cleaned, and where the cleaning chamber includes a heater for heating the interior space; and an expansion chamber fluidly coupled to the cleaning chamber via a release line for emptying the cleaning chamber, where the release line includes a release valve to selectively open or close a flow path between the expansion chamber and the cleaning chamber, and where the expansion chamber includes a cooler and a vacuum port. 本文提供用于清洁在基板处理装备中使用的部件的方法及清洁系统的实施方式。在某些实施方式中，一种清洁系统包括锅炉，该锅炉具有被配置成加热流体的加热器；清洁腔室，该清洁腔室经由气体管线及液体管线的至少一者流体耦接至锅炉，其中清洁腔室包括在其内部空间中的一个或多个夹具，用于保持待清洁的至少一个部件，且其中清