Mechanism component capable of detecting adhesive strength and electronic device

The invention provides a mechanism component capable of inspecting adhesive strength and an electronic device. The mechanism component is assembled on a shell. The mechanism component comprises a main structure part, a bridging part and an inspection part. The main structural portion is attached to...

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Hauptverfasser: LI PINXUE, XIE YONGCUN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a mechanism component capable of inspecting adhesive strength and an electronic device. The mechanism component is assembled on a shell. The mechanism component comprises a main structure part, a bridging part and an inspection part. The main structural portion is attached to the housing. The bridge portion connects the main structure portion and has a disconnectable characteristic. The inspection part is connected to the position, different from the main structure part, of the bridging part and is attached to the shell. The inspection part bears external force after the bridging part is cut off, so that the adhesion strength between the main structure part and the shell is evaluated according to the separation degree of the inspection part and the shell. 本发明提供一种可检验附着强度的机构件及电子装置,机构件组装于壳件上。该机构件包含有主结构部、桥接部以及检验部。主结构部附着于壳件。桥接部连接主结构部,并且具有可截断特性。检验部连接在桥接部的异于主结构部的位置、且附着壳件。检验部在桥接部被截断后承受外部施力,以根据检验部与壳件的分离程度评估主结构部和壳件之间的附着强度。