Stepped golden finger clamping board, manufacturing method and stepped structure PCB (Printed Circuit Board)

The invention belongs to the technical field of electronic products such as high-performance graphics cards and acceleration cards, and discloses a stepped golden finger card board, a manufacturing method and a stepped-structure PCB (printed circuit board). The method comprises the following steps: processing a golden finger pasting cover film: exposing and etching an inner layer, and pasting the cover film; pP windowing processing is carried out, wherein PP windowing is carried out in a board milling mode; and inner layer laser hole deep processing: performing inner layer exposure, etching and laser hole depth determination. The step golden finger clamping plate manufactured by the invention overcomes the defects of excessive glue on the golden finger, poor uncovering and the like, improves the qualified rate, and ensures the mass production of products. According to the method, the relation of hole depth parameters is constructed through the control method that the depth is controlled by 50% through laser,