Method for manufacturing printed circuit board

The invention provides a method for manufacturing a printed circuit board. In a method for manufacturing a printed circuit board (11) by a subtraction method, a preparation step is performed in which a metal-clad laminate (1) is prepared, the metal-clad laminate (1) being provided with a metal layer...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NISHINO KOTA, OSUMI TOMONORI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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