Method for manufacturing printed circuit board

The invention provides a method for manufacturing a printed circuit board. In a method for manufacturing a printed circuit board (11) by a subtraction method, a preparation step is performed in which a metal-clad laminate (1) is prepared, the metal-clad laminate (1) being provided with a metal layer (2) for forming a metal support substrate (12) of the printed circuit board (11) and a photosensitive resin layer (3) for forming a metal support substrate (12) of the printed circuit board (11), and a development step is performed in which the photosensitive resin layer (3) is formed on the metal support substrate (12). And a developing step in which the photosensitive resin layer (3) is a precursor for a first insulating layer (13) of the wiring circuit board (11), the photosensitive resin layer (3) is disposed on the metal layer (2), and the photosensitive resin layer (3) is exposed and developed. 本发明提供一种布线电路基板的制造方法。在基于减成法的布线电路基板(11)的制造方法中，执行准备工序和显影工序，在该准备工序中，准备覆金属层叠板(1)，该覆金属层叠板(1)具备金属层(2)和感光性树脂层(3)，该金属层(2)用于形成