HDI plate capable of improving incomplete glue removal at bottom of blind hole and manufacturing method of HDI plate

The invention belongs to the technical field of PCBs (Printed Circuit Board), and discloses an HDI (High Density Interconnect) board for improving incomplete glue removal at the bottom of a blind hole and a manufacturing method. According to the method, a micro-etching process is added after laser drilling and before plasma, copper teeth protruding at the bottom are removed, and in the step of removing the copper teeth protruding at the bottom, deviation of the protruding copper teeth is removed to be matched with filtering; in the removal size calibration of the raised copper teeth of the HDI plate, the repeated structure causes the removal deviation matching of the raised copper teeth; carrying out copper tooth size information fusion in the coordinate system of the weakly-raised copper tooth removal data set; when the detection points in the HDI board are not sufficient, copper tooth size matching information is fused together through copper tooth size information generated in the micro-etching process; de