Photosensitive component, camera module and corresponding manufacturing method

The invention relates to a photosensitive component, which comprises a photosensitive chip; the packaging body is integrally manufactured around the photosensitive chip through a molding or mould pressing process and is in contact with the peripheral surface of the photosensitive chip, the packaging body and the photosensitive chip are combined into a whole in the molding process, and the packaging body does not extend to the upper surface and the lower surface of the photosensitive chip; the lower surface of the circuit board is attached to the upper surface of the packaging body, the circuit board is provided with a light through hole, the light sensing chip is arranged at a position corresponding to the light through hole, and the circuit board and the light sensing chip have no overlapping area under an overlook angle; wherein the photosensitive chip is electrically connected with the circuit board through a lead bonding process. The invention further provides a corresponding manufacturing method and a ca