Packaging structure and manufacturing method of radio frequency receiving module

The invention belongs to the field of mobile communication, and designs a packaging structure and a manufacturing method of a radio frequency receiving module. Comprising a substrate, a filter chip, a radio frequency switch chip, a solder mask layer and a filler, wherein the filter chip and the radio frequency switch chip are welded on the substrate in a flip-chip manner, the filler coats the filter chip and the radio frequency switch chip, a solder mask layer is arranged on the surface of one side, facing the filler, of the substrate, and a cavity is formed between the filter chip and the solder mask layer; wherein a groove is formed in the side, away from the substrate, of the solder mask layer, and the groove is located between a welding spot and the edge of the filter chip from the top view. Compared with a non-grooving mode, the resin needs to pass through more paths when reaching points with the same distance, solidification of the resin is accelerated, the time needed for the resin to reach the points