Semiconductor structure and manufacturing method

The invention discloses a semiconductor structure and a manufacturing method. The manufacturing method comprises the following steps: S1, providing a substrate; s2, double rows of copper columns and working elements are installed on the surface of the substrate, and the top ends of the double rows of copper columns are combined through connecting pieces; s3, packaging is carried out, a packaging layer is formed, and the packaging layer covers the substrate, the double rows of copper columns and the working elements; and S4, the packaging layer and the connecting piece are thinned, and the double rows of copper columns are exposed. By changing the copper columns into the double-row copper columns, the resistance during injection molding is increased, so that the double-row copper columns have larger supporting force and are not easy to incline or topple due to too large resistance during injection molding, and the production quality of the semiconductor structure is improved. 本发明揭示了一种半导体结构及制造方法，包括：S1、提供基板；S2、在