Semiconductor device

This semiconductor device is provided with: a substrate having a main surface facing in the thickness direction; a first lead that has a mounting surface facing the same side as the main surface in the thickness direction, and is fixed to the main surface; and a first semiconductor element disposed...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	TAJIRI HIROYUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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