Semiconductor device

This semiconductor device is provided with: a substrate having a main surface facing in the thickness direction; a first lead that has a mounting surface facing the same side as the main surface in the thickness direction, and is fixed to the main surface; and a first semiconductor element disposed on the mounting surface. A size of the substrate in a first direction orthogonal to the thickness direction is larger than a size of the substrate in a second direction orthogonal to the thickness direction and the first direction. The first lead includes: a first region that overlaps the first semiconductor element when viewed in the thickness direction; and a second region which is located at a position separated from the first semiconductor element when viewed in the thickness direction, and at least a portion of which extends in the second direction. The thickness of the second area is smaller than that of the first area. 本发明提供一种半导体装置，其具备：基板，其具有朝向厚度方向的主面；第一引线，其具有在所述厚度方向上朝向与所述主面相同的侧的搭载面，并且固定于所述主面上；以及第一半导体元件，其配置于