INSULATING CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME

Embodiments provide a ceramic copper circuit board in which reliability of bonding with a bonding layer is improved. The insulating circuit board according to an embodiment is provided with an insulating substrate and a conductor part bonded to at least one surface of the insulating substrate, and is characterized in that the average value of the nitrogen content at any three locations is within the range of 0 at% to 50 at% (inclusive) when the nitrogen content of the surface of the conductor part is subjected to XPS analysis. It is preferable that the average value of the oxygen amounts at the three locations is within the range of 3 at% to 30 at% (inclusive) when XPS analysis is performed on the oxygen amount at the surface of the conductor part. The ratio of the nitrogen content to the oxygen content is preferably from 0 to 5 (inclusive). 实施方式提供改善了与接合层的接合的可靠性的陶瓷铜电路基板。实施方式的绝缘性电路基板的特征在于，其具备绝缘性基板、和与上述绝缘性基板的至少一个面接合的导体部，在对上述导体部的表面的氮量进行XPS分析时，任意3处的上述氮量的平均值为0at％以上且50at％以下的范围内。在对上述导体部表面的氧量进行XPS分析时，上述3处的上述氧量的平均值优选为