Adhesive tape pasting device for flexible circuit board cover film

The invention relates to the technical field of flexible circuit board cover films, and discloses a flexible circuit board cover film rubberizing device which comprises a rubberizing table, a guide rail penetrating through the lower portion of the rubberizing table and two mounting frames connected...

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1. Verfasser: WANG WUDONG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to the technical field of flexible circuit board cover films, and discloses a flexible circuit board cover film rubberizing device which comprises a rubberizing table, a guide rail penetrating through the lower portion of the rubberizing table and two mounting frames connected above the rubberizing table in a lifting mode, and a transverse frame and a slitting blade arranged in a square mode are mounted on the rubberizing table through the mounting frames. A flexible circuit board is placed on a tray and sequentially fed to the position below a rubberizing table, the flexible circuit board is sequentially jacked under the action of a telescopic rod b, a cover film with a protective film torn off is guided and conveyed to the position above the jacked tray through a guide wheel, a sinking scraping piece acts on the cover film attached to the surface of the flexible circuit board, and the cover film is pushed from the middle to the two sides; bubbles between the covering film and the flexi