Chip packaging structure, preparation method thereof and terminal equipment

The invention discloses a chip packaging structure, a preparation method thereof and terminal equipment. The chip packaging structure comprises a chip; the surface of the chip is provided with a plurality of exposed conductive gaskets; the plurality of bump structures are respectively positioned on the plurality of conductive pads, each bump structure in the plurality of bump structures comprises a metal layer and one or more welding caps positioned on the metal layer, and the plurality of welding caps are arranged on the metal layer of at least one bump structure in the plurality of bump structures. According to the chip packaging structure provided by the embodiment of the invention, the plurality of welding caps are arranged on the metal layer of the at least one bump structure, so that the occupied area proportion of the bump structures on the chip can be increased, the pressure of the bump structures on the interior of the chip in the packaging and manufacturing process can be dispersed, and the reliabil