Method for manufacturing wiring board

The invention provides a method for manufacturing a wiring board, which can perform inspection more reliably. A method for manufacturing a wiring board according to the present invention comprises the steps of: preparing a first support plate having a metal foil on the surface of a support base; forming a wiring substrate (1) having a first surface (1F) and a second surface on the metal foil in such a manner that the first surface (1F) faces the metal foil; pasting a second support plate (200) on the second surface of the wiring substrate (1); and after the second support plate (200) is adhered, separating the support substrate from the metal foil, and removing the metal foil from the first surface (1F) to expose the first surface (1F). The first surface (1F) includes a plurality of first conductor pads (P1), the second surface includes a plurality of second conductor pads (P2), a first conduction test between the plurality of second conductor pads (P2) is performed before the second support plate (200) is ad