Efficient removal of slot test device during wafer dicing

In some examples, a method (1100) for manufacturing a semiconductor package includes coupling a photoresist layer to a non-device side of a semiconductor wafer having a device side, first and second circuits formed in the device side and separated by a scribe line, and a test device (1102, 1104) positioned in the scribe line. The method also includes coupling a tape to the device side of the semiconductor wafer (1106). The method further includes performing a lithographic process to form an opening in the photoresist layer and plasma etch through the semiconductor wafer through the opening in the photoresist layer to produce first and second semiconductor dies (1108, 1110) having first and second circuitry, respectively. The method also includes removing the tape from the device sides of the first and second semiconductor dies, including removing the test device (1116). The method also includes coupling the first circuit of the first semiconductor die to the conductive feature (1118). The method further inclu