Material pressure forming device for new material development

The invention discloses a material pressure forming device for new material development, and belongs to the technical field of new material technology development, and the material pressure forming device is technically characterized by comprising a pressure assembly, a buffer assembly, a clamping a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LU HAO, SUN YUMEI, ZHANG ZISHANG, YANG DONG, LIU HAO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a material pressure forming device for new material development, and belongs to the technical field of new material technology development, and the material pressure forming device is technically characterized by comprising a pressure assembly, a buffer assembly, a clamping assembly, a heat dissipation assembly and a linkage assembly. When a material is pressurized, the material is placed on the clamping assembly, the clamping assembly is started, the clamping assembly can clamp and fix the material, the pressurizing assembly is started, and the pressurizing assembly can drive the pressing plate to slide up and down in a reciprocating mode through the buffering assembly. According to the heat dissipation device, the pressing plate is arranged on the pressing plate, so that the pressing plate can machine materials, the buffering assembly can buffer the pressurizing assembly, when the pressurizing assembly slides, the pressurizing assembly can intermittently make contact with the heat di