Bonding method and bonding device

The invention relates to a laminating method and a laminating device. The laminating method comprises the following steps: placing demolding glue and a to-be-laminated part on a bearing surface of a carrier along a first direction; the outer contour of the orthographic projection of the demolding glue on the reference surface is located outside the outer contour of the orthographic projection of the piece to be subjected to film pasting on the reference surface; wherein the reference surface is perpendicular to the first direction; the film material is attached to the surface of the side, away from the bearing face, of the piece to be subjected to film attaching; the demolding glue, the attached film material and the to-be-attached film piece are separated from the bearing surface; and the bonding force between the film material and the bearing surface is greater than that between the demolding glue and the bearing surface. According to the laminating method and the laminating device, the laminating device at