Lead-free solder alloy and preparation method

The invention discloses a lead-free solder alloy and a preparation method, and belongs to the technical field of electronic packaging and materials. The Sn-Zn-Bi-Mg alloy comprises the following components in percentage by mass: 8%-10% of Zn, 2%-4% of Bi, at least one of 0.05%-0.5% of Al and 0.05%-0...

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Bibliographische Detailangaben
Hauptverfasser:	TU WENBIN, WANG SHANLIN, XIE JILIN, CHEN YUHUA, WANG HANBING, WU JISI, ZHANG TIMING, LIU GUANPENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The invention discloses a lead-free solder alloy and a preparation method, and belongs to the technical field of electronic packaging and materials. The Sn-Zn-Bi-Mg alloy comprises the following components in percentage by mass: 8%-10% of Zn, 2%-4% of Bi, at least one of 0.05%-0.5% of Al and 0.05%-0.5% of Mg, and the balance of Sn. The Sn-Zn-Bi system lead-free solder alloy disclosed by the invention has the advantages of low cost, no toxicity, low melting point, good oxidation resistance and better mechanical property, is suitable for all lead-free solder in the field of electronic packaging, and has a good brazing effect. 本发明公开了一种无铅钎料合金及制备方法，属于电子封装与材料技术领域。各组分按质量百分比，包括Zn：8～10％，Bi：2％～4％，至少含有Al：0.05～0.5％，Mg：0.05～0.5％，中的一种，余量为Sn。本发明公开的Sn-Zn-Bi系无铅钎料合金，具有成本低、无毒性、熔点低、抗氧化性好及较好的力学性能，适用于电子封装领域所有的无铅钎料，具有良好的钎焊效果。