Preparation method of tungsten-copper composite board for high-heat-load part of Tokamak device

The invention discloses a preparation method of a tungsten-copper composite board for a high-heat-load part of a Tokamak device, which comprises the following steps of: 1, respectively cleaning a tungsten sheet and an oxygen-free copper sheet which are consistent in size, and combining the tungsten...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WEN YAHUI, SHI BODONG, YANG SIYAO, LYU XIAOTIAN, LIN JIHUI, WU NING
Format: Patent
Sprache:chi ; eng
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