Preparation method of tungsten-copper composite board for high-heat-load part of Tokamak device

The invention discloses a preparation method of a tungsten-copper composite board for a high-heat-load part of a Tokamak device, which comprises the following steps of: 1, respectively cleaning a tungsten sheet and an oxygen-free copper sheet which are consistent in size, and combining the tungsten...

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Hauptverfasser: WEN YAHUI, SHI BODONG, YANG SIYAO, LYU XIAOTIAN, LIN JIHUI, WU NING
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a preparation method of a tungsten-copper composite board for a high-heat-load part of a Tokamak device, which comprises the following steps of: 1, respectively cleaning a tungsten sheet and an oxygen-free copper sheet which are consistent in size, and combining the tungsten sheet and the oxygen-free copper sheet together through a tool to obtain a tungsten-copper composite board; secondly, the tungsten-copper composite board is placed in electron beam welding equipment, and then first electron beam welding is conducted on one side of the tungsten-copper composite board; and thirdly, second-time electron beam welding is conducted on the other side of the tungsten-copper composite board subjected to first-time electron beam welding, and the tungsten-copper composite board is obtained. According to the method, the tungsten-copper composite board is obtained through two-time electron beam welding compounding from the two sides of the tungsten-copper composite board, combination of the tun