Regional selective atomic layer deposition of passivation layers

Methods of enhancing selective deposition are described. In some embodiments, a passivation layer is deposited on a metal surface prior to deposition of a dielectric material. Block I molecules are deposited on a metal surface, and block II molecules are reacted with the block I molecules to form a...

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Bibliographische Detailangaben
Hauptverfasser:	LEONI, ANDREA, DORIN WEIYING YONG, SUDIJONO, JOHN, WANG YONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	Methods of enhancing selective deposition are described. In some embodiments, a passivation layer is deposited on a metal surface prior to deposition of a dielectric material. Block I molecules are deposited on a metal surface, and block II molecules are reacted with the block I molecules to form a passivation layer. 描述了增强选择性沉积的方法。在一些实施方式中，在介电材料的沉积之前，在金属表面上沉积钝化层。在金属表面上沉积嵌段I分子，并且使嵌段II分子与所述嵌段I分子反应以形成钝化层。