Methods of bonding copper and articles formed thereby

Disclosed is an article comprising at least two substrates; and a tackifier wherein the tackifier is a compound of formula I: (I) wherein x is an integer from 1 to 4, y is an integer from 2 to 6, and z is an integer from 1 to 6; and a structural adhesive positioned at least between the two substrates. Structural adhesives comprising such tackifiers and methods for bonding two substrates are also disclosed herein. 本发明公开了制品，该制品包括至少两个基底；以及增粘剂，其中所述增粘剂是式I的化合物，(I)其中x为1至4的整数，y为2至6的整数，并且z为1至6的整数；以及至少定位于两个基底之间的结构粘合剂。本文还公开了包含此类增粘剂的结构粘合剂和用于粘结两个基底的方法。