Composite material, semiconductor package, and method for manufacturing composite material

The composite material is in a plate shape and is provided with a first surface and a second surface. The second surface is an opposite surface of the first surface. The composite material has a plurality of first layers and at least one second layer. The first layers and the second layers are alternately stacked in the thickness direction of the composite material in the mode that the first layers are located on the first surface and the second surface. The first layer is a layer comprising copper. The second layer is a layer of a molybdenum powder compact impregnated with copper. The compressive residual stress acting on the first layer on the first surface and the first layer on the second surface is 50 MPa or less. 本发明的复合材料为板状，具有第一表面和第二表面。第二表面是第一表面的相反面。复合材料具有多个第一层和至少一个第二层。第一层和第二层以第一层位于第一表面和第二表面的方式沿复合材料的厚度方向交替层叠。第一层是包含铜的层。第二层是含浸有铜的钼粉末压坯的层。作用于位于第一表面的第一层以及位于第二表面的第一层的压缩残余应力为50MPa以下。