SEMICONDUCTOR DEVICE PACKAGE WITH EXPOSED BOND WIRE

The invention discloses a semiconductor device package. The semiconductor device package includes a first substrate having a circuit, semiconductor dies stacked one above the other, and bonding wires electrically connected to each other. The bond wire electrically couples the semiconductor dies to each other and to the circuit. There is a first bond wire having a first portion connected to the first semiconductor die, a second portion connected to the second semiconductor die, and an intermediate portion between the first portion and the second portion. The semiconductor device package also includes a molding compound encapsulating the semiconductor die and the first portion and the second portion of the first bond wire. The intermediate portion of the first bond wire is exposed along a top planar surface of the molding compound. The semiconductor device package may be used to couple one or more other semiconductor device packages thereto via the exposed intermediate portion. 本发明公开了一种半导体器件封装件，该半导体器件封装件包括具有电路的