Semiconductor structure and manufacturing method thereof, chip and photon computing system

The invention relates to the field of semiconductors, and provides a semiconductor structure and a manufacturing method thereof, a chip and a photon computing system.The manufacturing method of the semiconductor structure comprises the steps that a multi-layer structure is provided, and the multi-la...

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Bibliographische Detailangaben
Hauptverfasser: MENG HUAIYU, SHEN YICHEN, ZHU XUANTING
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to the field of semiconductors, and provides a semiconductor structure and a manufacturing method thereof, a chip and a photon computing system.The manufacturing method of the semiconductor structure comprises the steps that a multi-layer structure is provided, and the multi-layer structure comprises a supporting substrate, a middle layer arranged on the supporting substrate and a waveguide material layer arranged on the middle layer; the waveguide material layer is etched to form a waveguide, and a recess is formed in the middle layer in the etching process; depositing a first silicon oxide layer, wherein the first silicon oxide layer covers the sunken side wall of the middle layer; and forming a second silicon dioxide layer on the side wall of the waveguide, including oxidizing the side wall of the waveguide to form the second silicon dioxide layer. According to the embodiment of the invention, the formation of the semiconductor structure can be optimized. 本发明涉及半导体领域,提出一种半导体结构及其制造方法、芯片