Jet flow soldering device
A jet soldering device (100) is provided with a first case (121), a first supply port (125) which is provided in the first case (121) and supplies molten solder (S), a second case (131), and a second supply port (135) which is provided in the second case (131) and supplies molten solder (S). The mol...
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| Sprache: | chi ; eng |
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| Zusammenfassung: | A jet soldering device (100) is provided with a first case (121), a first supply port (125) which is provided in the first case (121) and supplies molten solder (S), a second case (131), and a second supply port (135) which is provided in the second case (131) and supplies molten solder (S). The molten solder (S) supplied from the first supply port (125) and the molten solder (S) supplied from the second supply port (135) are mixed, and the mixed molten solder (S) is not separated from the substrate (200) transported by the transport unit (5) between the first supply port (125) and the second supply port (135).
喷流软钎焊装置(100)具有第一壳体(121)、设置于所述第一壳体(121)并供给熔融软钎料(S)的第一供给口(125)、第二壳体(131)和设置于所述第二壳体(131)并供给熔融软钎料(S)的第二供给口(135)。从所述第一供给口(125)供给的熔融软钎料(S)和从所述第二供给口(135)供给的熔融软钎料(S)混合，混合了的熔融软钎料(S)在所述第一供给口(125)与所述第二供给口(135)之间不从由搬运部(5)搬运的基板(200)分离。 |
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