Adhesive film for circuit connection, method for producing same, and method for producing circuit connection structure

The adhesive film (1) for circuit connection is provided with a first adhesive layer (2) and a second adhesive layer (3) laminated on the first adhesive layer (2), the first adhesive layer (2) contains light and a cured product of a thermosetting composition, and the second adhesive layer (3) contai...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ITO AKIHIRO, KUDOU SUNAO, OOATARI, YUMIKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!