Adhesive film for circuit connection, method for producing same, and method for producing circuit connection structure

The adhesive film (1) for circuit connection is provided with a first adhesive layer (2) and a second adhesive layer (3) laminated on the first adhesive layer (2), the first adhesive layer (2) contains light and a cured product of a thermosetting composition, and the second adhesive layer (3) contains a thermosetting composition. The photocurable and thermosetting composition contains a polymerizable compound, a photopolymerization initiator, a thermal polymerization initiator, conductive particles (4), and a thiol compound. 一种电路连接用黏合剂薄膜(1)，其具备第1黏合剂层(2)、及层叠于第1黏合剂层(2)上的第2黏合剂层(3)，第1黏合剂层(2)包含光及热固性组合物的固化物，第2黏合剂层(3)包含热固性组合物，光及热固性组合物含有聚合性化合物、光聚合引发剂、热聚合引发剂、导电粒子(4)及硫醇化合物。