Circuit board with heat dissipation bumps and manufacturing method

The invention discloses a circuit board with heat dissipation bumps and a manufacturing method, the circuit board comprises a first conductive plate group layer, a heat dissipation plate group layer and a second conductive plate group layer which are stacked in sequence, the heat dissipation plate group layer comprises a plurality of heat conduction and electric conduction plate blocks and insulation plate blocks, the insulation plate blocks are located between the adjacent heat conduction and electric conduction plate blocks, and the insulation plate blocks are located between the adjacent heat conduction and electric conduction plate blocks. Each heat conduction and electric conduction plate is provided with a heat dissipation protruding block protruding out of the surface of the heat conduction and electric conduction plate, and the heat dissipation protruding blocks penetrate through at least one of the first electric conduction plate set layer and the second electric conduction plate set layer to be expo