Semiconductor packaging structure

The embodiment of the invention provides a semiconductor packaging structure. The semiconductor packaging structure comprises a substrate; the chip is located on the substrate, a passive surface of the chip is provided with a plurality of first bonding pads, and the plurality of first bonding pads a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CAI CHENGYOU, WANG CHENZHAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The embodiment of the invention provides a semiconductor packaging structure. The semiconductor packaging structure comprises a substrate; the chip is located on the substrate, a passive surface of the chip is provided with a plurality of first bonding pads, and the plurality of first bonding pads are used for being connected with one of a power supply and a ground; the circuit layer is located on the chip; the upper surface of the circuit layer is provided with a first circuit board bonding pad used for being connected with the first flexible circuit board, the first circuit board bonding pad and the first bonding pads are electrically connected through the circuit layer, one end of the first flexible circuit board is connected to the first circuit board bonding pad, and the other end of the first flexible circuit board is connected to the second bonding pad. The other end of the first flexible circuit board is connected to the substrate. According to the technical scheme, at least the number of the leads in