SEMICONDUCTOR PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF

According to the semiconductor packaging device and the manufacturing method thereof, the first supporting body is arranged on the first dielectric layer and located in the interval space between the first metal layer and the first via hole, so that the supporting capacity of the second dielectric layer is improved, and the problems that the supporting capacity is reduced due to the fact that the copper amount between the dielectric layers is reduced, and the reliability of the semiconductor packaging device is improved are solved. And the problems that the flatness is reduced and the combining capacity is reduced are further solved. 本公开提出了半导体封装装置及其制造方法，通过在第一介电层上、位于第一金属层和第一导通孔之间的间隔空间内设置第一支撑体，来提升对第二介电层的支撑能力，解决了介电层之间因铜量减少使得支撑能力降低，进而产生的平整度下降、结合能力降低的问题。