SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

The invention discloses a semiconductor device and a manufacturing method thereof. The semiconductor device comprises a substrate. The semiconductor device also includes a conductive network on the first side of the substrate. The semiconductor device also includes an active region on the second side of the substrate, wherein the first side of the substrate is opposite the second side of the substrate. The semiconductor device also includes a through via electrically connected to the conductive network, wherein the through via extends through the substrate. The semiconductor device further includes a contact structure on the second side of the substrate, where the contact structure is electrically connected to the active region, the contact structure is in direct contact with the through via, and the contact structure overlaps a top surface of the through via in a top view. 一种半导体装置及其制造方法，半导体装置包括一基板。半导体装置还包括在基板的第一侧上的导电网络。半导体装置还包括在基板的第二侧上的主动区域，其中基板的第一侧与基板的第二侧相对。半导体装置还包括电性连接到导电网络的贯通导孔，其中贯通导孔延伸穿过基板。半导体装置还包括在基板的第二