SEMICONDUCTOR PACKAGE

A semiconductor package includes: a package substrate; the power supply module is positioned on the first surface of the packaging substrate; a connector on the first surface of the package substrate, the connector being horizontally spaced apart from the power module; the first semiconductor chip is located on a second surface, opposite to the first surface, of the packaging substrate; and a first heat sink on the second surface of the package substrate, the first heat sink covering the first semiconductor chip. The first semiconductor chip vertically overlaps the power module, and the first semiconductor chip is electrically connected to the power module through the package substrate. 一种半导体封装件包括：封装基板；电源模块，位于所述封装基板的第一表面上；连接器，位于所述封装基板的所述第一表面上，所述连接器与所述电源模块水平地间隔开；第一半导体芯片，位于所述封装基板的与所述第一表面相对的第二表面上；以及第一散热器，位于所述封装基板的第二表面上，所述第一散热器覆盖所述第一半导体芯片。所述第一半导体芯片与所述电源模块垂直地交叠，并且所述第一半导体芯片通过所述封装基板电连接到所述电源模块。