Sputtering target member, method for producing same, method for producing sputtering film, and magnetron sputtering device

The invention provides a sputtering target member which can perform uniform sputtering and can efficiently use a target base material. The sputtering target member is characterized in that the sputtering target member is provided with a target base material layer, and is further provided with a magn...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KONNO YOSHINORI, SUZUKI TSUGUTO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The invention provides a sputtering target member which can perform uniform sputtering and can efficiently use a target base material. The sputtering target member is characterized in that the sputtering target member is provided with a target base material layer, and is further provided with a magnetic layer containing a magnetic material so as not to be exposed to a sputtering surface of the target base material layer. 本发明提供溅射靶构件，其可进行均匀的溅射，同时可高效使用靶母材。一种溅射靶构件，其特征在于：其是具备靶母材层的溅射靶构件，以不暴露于上述靶母材层的溅射面的方式，进一步具备含有磁性材料的磁性层。