Automobile electronic PCB capable of eliminating CAF effect and manufacturing method

The invention belongs to the technical field of PCBs, and discloses an automotive electronic PCB capable of eliminating a CAF effect and a manufacturing method. The manufacturing method comprises the following steps: designing and optimizing jointed boards: inclining the jointed boards in the units by 10-15 degrees; the process optimization comprises the steps of pressing, drilling, board baking, copper deposition and board power. Under the condition that the cost is not increased, the CAF problem is improved by 100% from the aspect of process design. The generation of the CAF is derived along the direction of the glass yarn bundle, and when the inclination angle of the drilled hole is staggered, a roundabout effect can be formed on the generation of the CAF, so that the effect of reducing the CAF is achieved; certain stress can be generated after the PCB is subjected to high-drilling-speed and high-feed drilling, and the CAF problem can be reduced by eliminating the drilling stress before copper deposition.