Wafer-level packaging method and packaging structure for improving image problem

The invention discloses a wafer level packaging method and a packaging structure for improving an image problem. The packaging method comprises the following steps: step 1, carrying out bonding, thinning and silicon etching on a wafer; 2, preparing a black shading layer on the silicon-based surface of the wafer; 3, preparing an insulating layer on the silicon-based surface, redistributing a circuit, and setting a solder mask; and 4, growing a solder ball, and cutting to obtain a single chip. According to the wafer-level packaging method and packaging structure for improving the image problem, the black shading layer is prepared through silk-screen printing or 3D printing, the image effect can be improved, dazzle and ghosting can be prevented, the process is simple, the cost is low, exposure and development are not needed, the risk of unclean development does not exist, the binding force of a post-processing process is not affected, and the production efficiency is improved. The method can be used for replacin