High-yield single-chip back metallization clamp and use method

The invention discloses a high-yield single-chip back metallization clamp and a use method, the high-yield single-chip back metallization clamp comprises a chip tray and a chip mask, the chip tray comprises a chip tray base, the periphery of the chip tray base is provided with positioning holes, the chip tray is provided with uniformly distributed chip grooves, the chip mask comprises a chip mask plate, and the chip mask plate is provided with positioning holes. The chip mask plate is provided with uniformly distributed mask through holes, the periphery of the chip mask plate is provided with positioning pins, the chip mask is fixedly connected with the chip tray through the positioning pins, the area of the mask through holes is smaller than that of the chip grooves, and the edges of the through holes in the chip mask cover the four edges of the chip. The position of the chip is fixed in a chip groove mode, core placing and taking operation is simplified, relative sliding between the chip and the tray is red