System and method for automatically identifying defect-based test coverage gaps in semiconductor devices

Automatically identifying defect-based test coverage gaps in semiconductor devices includes: determining a plurality of significantly fatal defects on one or more semiconductor devices having a plurality of semiconductor dies based on characterization measurements of the one or more semiconductor devices acquired by one or more semiconductor manufacturing subsystems; determining at least one semiconductor die passing the at least one test based on test measurements acquired by the one or more test tool subsystems; associating the characterization measurement with the test measurement to determine at least one significantly fatal defect on the at least one semiconductor die passing the at least one test; and determining one or more gap regions on the one or more semiconductor devices for defect-based test coverage based on the at least one significantly fatal defect on the at least one semiconductor die through the at least one test. 自动识别半导体装置中基于缺陷的测试覆盖间隙包含：基于由一或多个半导体制造子系统获取的具有多个半导体裸片的一或多个半导体装置的表征测量来确定所述一或多个半导