Probe card repairing method

The invention discloses a method for repairing a probe card. The method comprises the following steps: growing a metal PAD at a metal PAD position on a packaging substrate of the probe card through a 3D printing method; and repairing the damaged bonding pad or line on the surface of the PCB of the probe card through a 3D printing method. The probe card repairing method is simple, effective, easy to operate, high in yield and short in time period, defects on the surfaces of the PCB and the substrate can be repaired, meanwhile, a metal PAD can be manufactured, and rapid and efficient repairing of the probe card is achieved. 本发明公开了一种探针卡的修补方法,通过3D打印方法对探针卡的封装基板上金属PAD位置进行生长金属PAD；通过3D打印方法对探针卡的PCB板表面破损的焊盘或者线条进行修补。本发明提出一种简单有效，操作简单，良率高，时间周期短的探针卡修补方法，可以将PCB和基板表面的缺陷进行修复并同时可以制作金属PAD，实现探针卡的快速高效修补。